PCBA Test

PCBA Test

We totally understand that bad quality products will bring our customers huge loss  and will damage both ours and our customers’ reputation, so we perform multiple quality assurance procedures before shipping out any of our board to guarantee our quality. 
These testing methods include:
• Visual Inspection,
• X-Ray Inspection,
• AOI Inspection, 
• Voltage Test,
• Chip Programming,
• ICT test (In-circuit test), and
• Functional test (test guide need to be supplied).


Automated Optical Inspection (AOI)

 
Range Tolerance
Accuracy ±0.0024mm
Speed 5in²/sec(60FOV/sec)
PCB Max size 400mm*330mm
Available package 01005 and fine pitch



What defects AOI can distinguish:

 
  Defect Type AOI
Components Lifted lead
  Missing components
  Misaligned/Misplaced components
Soldering Open circuits
  Solder bridges
  Solder shorts
  Insufficient solder
  Excess solder

Automated X-Ray Inspection(AXI)

AXI is applied to test complicated circuit boards containing components with array-style packaging or fine pitch packaging including BGAs, CGAs (Column Grid Arrays), CSPs (Chip Size Package), etc. AXI is usually placed in the assembly process, just after the last soldering no matter wave soldering or reflow soldering. Furthermore, AXI is usually applied coupled with boundary scan test, ICT and functional test in order to obtain optimal inspection results.

 


What defects AXI can distinguish:
 
  Defect Type AXI
Components Lifted lead
  Missing components
  Misaligned/Misplaced components
Soldering Open circuits
  Solder bridges
  Solder shorts
  Insufficient solder
  Solder void
  Solder quality
  Excess solder
BGA and CSP BGA Shorts
  BGA open circuit connections


Functional Test (FCT)

For Functional test, we just need customers provide us the testing instructions and testing software, then we will design the testing fixtures, programme the chips and test the boards as instructed. In such ways, all boards quality can be guaranteed before delivery.



Chip Programming

And chip programming will be performed before the chips are mounted on the board. We support various package types including:
  • DIP, SDIP                    QSOP, SSOP
  • TSSOP, PLCC             QFN, MLP
  • BGA, CSP                    SOT
  • SOP, MSOP                 TSOP
  • QFP, MLF                     DFN