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6 Common PCB Assembly Mistakes and Their Corrective Actions

When it comes to the end product's reliability, high-quality PCB fabrication and assembly are critical. Lack of sufficient planning can lead to significant failure rates as PCB designs get increasingly sophisticated. Continue reading to learn more about these typical flaws, their origins, and, most crucially, how to avoid them.

 #1 No Design for Manufacturability Checks

 
The most typical blunder is failing to do early design for manufacturability checks. These considerably lower the danger of often occurring PCB defects. When these checks are performed during the design stage, they ensure that any necessary corrections are made and that costly errors in the manufacturability stage are avoided. DFM allows manufacturers to examine a product's design in terms of size, materials, usefulness, and other factors. DFM also allows for the discovery of alternative, more efficient manufacturing methods. As a result, it saves both time and money because any design defects are discovered well before manufacturing begins.The absence of these checks, on the other hand, results in costly production halts and squandered runs.
 

#2 Solder Bridges

 
This is one of the most prevalent PCB assembly flaws. It occurs when two or more pads are joined to form a bridge, as the name implies. Solder bridges also have the disadvantage of being difficult to detect because to their small size. Solder bridges are known to occur as a result of the following factors:
 • Insufficient solder layer between pads
 • Insufficient gap between pads
 • Incorrectly placed components
 • Improper seal between the stencil and bare board during the printing process.
Due to component burning, an undetected solder bridge might cause PCB damage. To avoid solder bridges, it is critical to consider the elements listed above.
 

#3 Plating Voids

 
The transmission of electricity from through holes is hampered by an uneven copper coating on the inner walls of holes on the PCB. This could be due to a variety of circumstances, including:
 • Material contamination
 • Contaminated holes
 • Air bubbles in the material
It is critical to follow the manufacturer's instructions carefully during use to avoid plating voids. This could refer to the drill's proper speed or the necessary number of drill hits. Drilling too quickly might result in the formation of rough surfaces. Drill smear can occur if the drill is too sluggish.
 

#4 De-Wetting/Non-Wetting

 
De-wetting and non-wetting are two further things to avoid. When molten solder coats a surface and then recedes, this is known as de-wetting. This results in oddly shaped solder mounds. Non-wetting, on the other hand, is a state in which molten solder adheres to the surface just partially, leaving the metal exposed.
To avoid this, double-check that the components aren't expired and that the flux hasn't been abused.

 

#5 Electromagnetic Issues

 
Due to design errors, the PCB can suffer from the harmful effects of electromagnetic interference. As a result, it's critical to keep this in mind and focus on things like increasing PCB ground area to reduce electromagnetic interference and allow PCBs to function properly
 

#6 Physical Damage

 
PCB failure is frequently caused by physical degradation caused by environmental stressors during production. For instance, during prototyping, the PCB may be dropped. Components may be damaged as a result of this. The fact that the damage may not always be physically obvious adds to the complication. In such circumstances, the only alternative is to replace the PCB in order to avoid costly errors once the product is complete, or even worse, once the product has gone to market.
While the above list is by no means exhaustive, and there are a plethora of other circumstances that might lead to PCB problems, these are the most prevalent ones that can be readily avoided with a little forethought. In fact, as PCBs get smaller and more sophisticated, there are a lot of things to keep an eye on to assure success. As a result, it's critical that you collaborate with professionals who can anticipate many of these concerns, which, if not addressed early enough, can have far-reaching effects.


Yingstar offers PCB Assembly service with 10 years of expertise. Our accurate PCB assembly process meets the quality standards, including ISO 9001:2015, RoHS, and more. Our superior engineering capabilities mean that each board matches your exact requirements and technical specifications. In case if you have any questions, please feel free to contact us via email at sales@yingstar-pcba.com.